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Automated Microfocus X‑Ray Inspection System For BGA Solder Bridge Electronic Assembly NDT Testing Solution

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Automated Microfocus X‑Ray Inspection System For BGA Solder Bridge Electronic Assembly NDT Testing Solution

Name: Automated Microfocus XRay Inspection System For BGA Solder Bridge Electronic Assembly NDT Testing Solution
Brand: WELLMAN
Price: 1 USD

Certification : CE,ISO9001,FDA

Model Number : X6800

Focal Spot Size : 5μm

MOQ : 1

Packaging Details : Wooden case

Supply Ability : Worldwide supply

Payment Terms : T/T

Delivery Time : 7 work days

Brand Name : WELLMAN

Max Tube Voltage : 90kV

Place of Origin : China

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Automated Microfocus X-Ray Inspection System For BGA Solder Bridge Electronic Assembly NDT Testing Solution

Working Principle

Key Advantages

Speed adjustable 5-axis linkage system
New generation 5" HD digital flat panel detector
530×530mm table with 10KG load capacity
FPD tilts up to 60° without sacrificing magnification
Inspection procedures for automated batch inspection
Closed type X-ray tube with over 10,000 hours lifetime

Hardware Parameters

X-ray Source

Type	Closed, microfocus
Max Tube Voltage	90kV
Max Tube Current	200μA
Focal Spot Size	5μm
Function	Auto preheat

Flat Panel Detector

Effective Area	130mm×130mm
Pixel Size	85μm
Resolution	1536×1536
Frame Rate	20fps
Tiltable Angle	60°

Table

Size	530mm×530mm
Detectable Area	500mm×500mm
Max Load	10kg

Equipment Specifications

Magnification	Geometry 200X \| System 1500X
Inspection Speed	Max 3.0s/point
Dimensions	1360mm (L) × 1365mm (W) × 1730mm (H)
Weight	1200kg
Power Supply	AC110-220V 50/60HZ
Max Power	1500W
Industrial PC	I5 CPU, 8G RAM, 500GB SSD
Displayer	24" HDMI LCD

Software Functionality

Core Operations

Function Module	Keyboard and mouse complete all operations
X-ray Tube Control	Mouse-click activation with real-time voltage/current display and adjustable parameters
Status Bar	Visual indicators for interlock status, pre-heat status, and X-ray status
Image Effect Adjustment	Adjustable brightness, contrast and gain for optimal imaging
Product List	Save and recall inspection parameters for improved efficiency
Navigation Window	Click-to-move table positioning with camera guidance
Motion Axis Status	Real-time coordinate display
Inspection Result	Organized display of measurement results including voids rate, distance, area
Speed Control	Adjustable movement speed for each axis

Voids Rate Measurement

Automatic Calculation	Rectangle-based solder ball analysis with automatic void detection and NG/OK indication
Parameters Adjustment	Customizable grayscale threshold, pixel, contrast, and size filtering parameters
Add Voids Manually	Polygon or free-form drawing for manual void inclusion
Save Parameters	Store and recall measurement parameters for consistent product inspection

Additional Measurement Functions

Distance	Vertical distance measurement from point to baseline
Distance Rate	Percentage ratio calculation for through-hole soldering rate measurement
Angle	Angle measurement between defined rays
Radius	Circle measurement for round components with circumference, area and radius calculation
Perimeter	Square component measurement with length, width and area calculation

Automatic Inspection

Manual Setting	Custom inspection point positioning with automatic inspection and image saving
Array	Automated inspection of regular patterns using row and column configuration
Automatic Identification	Feature-based automatic position identification with measurement and image capture

Safety Features

Radiation Leakage	No leakage
Lead Glass Observation Window	Transparent lead glass window shields radiation to observe inner status
Window and Back Door Safety Interlock	Automatic X-ray power off when opened
Electromagnetic Safety Switch	Locks observation window when X-ray is active
Emergency Stop	Located near operation position for immediate power cutoff
Tube Protection	Prevents software exit without proper X-ray tube shutdown

Application Examples

BGA Solder Bridge

BGA Solder Voids

PCB Through-Hole

IC Voids and Gold Wire

LED Solder Voids

LED Gold Wire Crack

Capacitor

Inductor

Sensor

Thyristor Surge Suppressors

Fiberglass

Cable

Diode

Steel Pipe Welding Gap

Automotive Electronic

Product Tags:

Automated X-Ray Inspection System for BGA

Microfocus X-Ray Machine for Solder Bridge

Electronic Assembly NDT Testing Solution

Automated Microfocus X‑Ray Inspection System For BGA Solder Bridge Electronic Assembly NDT Testing Solution Images

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